AMD Opteron™ 4300 Series Processors Features, Specifications

  • AMD Opteron™ 4300 Series Processors Features, Specifications

AMD Opteron™ 4300 Series Processors Features, Specifications screenshot 1
The AMD Opteron™ 4300 Series processor is designed to lower datacenter TCO through unparalleled energy efficiency at an excellent value.

Ideal for power-conscious cloud deployments, the AMD Opteron 4300 Series processor has been streamlined to run applications faster than ever at the lowest possible energy draw.


Performance  Feature  Function  Benefit 
Next generation modular core architecture  Optimized performance per watt:
  • High frequency and low-power design
  • Virtualization enhancements
  • Shared double-sized Flex FP
  • IPC enhancements
The new processor core can help enhance power efficiency for server products:
  • Help minimize cooling solution complexities.
  • Help reduce power at low utilization.
  • Enable more control for IT managers.
AMD Turbo CORE Technology Turns unused TDP headroom into added clock speed for improved performance. The industry’s best full-core boost1 with up to a 300MHz frequency increase2.
Flex FP The world’s only flexible 256-bit FPU. Two 128-bit FMACs shared per module, allowing for dedicated 128-bit execution per core or shared 256-bit execution per module. Enhances flexibility and performance in technical computing.
High DDR3 Frequencies DDR3-1866 MHz support Outstanding performance for memory intensive applications
AMDP2.0 APML (Advanced Platform Management Link) Provides an interface for processor and systems management monitoring and controlling of system resources (in APML-enabled platforms); Comprised of the Remote Power Management Interface (RPMI) and the Precision Thermal Monitor Remote Power Management Interface (RPMI) in:
  • Ability to monitor and control platform power consumption via p-state limits
  • Access to processor identification and health
Precision Thermal Monitor:
  • Provides accurate information about CPU thermals to closely monitor power/cooling and proactively alert the Base Management Controller (BMC)
  • Early notification helps save time and money by providing intelligence that can be used to  effectively monitor power and thermals to optimize cooling solutions in an IT datacenter
TDP Power Cap  Allows the user to set the maximum processor power ceiling via BIOS or APML.  This technology gives enterprises the ability to customize their chips to meet power and workload demands, providing:
  • More control over power settings
  • Flexibility to set power limits without capping CPU frequencies
AMD CoolSpeed Technology  Protects processor integrity by reducing power-states, when a temperature limit is reached. 
  • Server can automatically drop into lower power mode if processor’s thermal environment exceeds safe operational limits
  • Offers platform providers the ability to safely reduce system fan speeds, which helps deliver greater platform efficiency 
C1E  Reduces memory controller and HyperTransport™ technology links’ power.  This feature can equate to a significant power savings in your datacenter depending on system configuration, when the Northbridge and HyperTransport™ technology links are powered down and cores are at idle. 
C6 Support  Core power gating: When a core is halted its context is exported to system memory and voltage is removed from the core.  Helps reduce power consumption at idle to minimize energy consumption when servers are not in use. 
LV-DDR3 Support Supports 1.25V and 1.35V DDR3  Helps to reduce overall power consumption. 
Ultra-low Power Platform  Specialized ultra-low power platforms great for cloud/dense environments.  Cooperative designs for specialized and ultra-low power platform providing power efficiency beyond just the processor. 
Direct Connect Architecture 2.0  HyperTransport™ Technology Assist (HT Assist)  Helps to increase coherent memory bandwidth and reduce latency in multi-node systems by reducing cache probe traffic between cores.  Reduces the amount of cache probe bus traffic enhancing a server’s efficiency and scalability. 
HyperTransport™ 3.0 Technology (HT3)  Provides superior system bandwidth between CPUs and I/O, increasing interconnect rate up to a maximum 6.4GT/s with HT3.  Helps improve overall system balance and scalability. 
Cache and Core Count  Integration of up to 8 cores within the same package, 1MB L2 cache per core (up to 8MB of L2 cache per socket), and a shared 8MB L3 cache per socket.  Offers outstanding performance and performance/watt  for multi-threaded environments like virtualization, database and web serving. 




AMD Opteron™ 4300 Series Processors
Model Number
Cores
Core Speed
AMD Turbo CORE Frequency
L3 Cache
TDP
Maximum Memory Support
Socket Type
4386
8
3.1GHz
3.8GHz
8MB
95W
DDR3-1866 MHz
C32
4376 HE
8
2.6GHz
3.6GHz
8MB
65W
DDR3-1866 MHz
C32
4340
6
3.5GHz
3.8GHz
8MB
95W
DDR3-1866 MHz
C32
4334
6
3.1GHz
3.5GHz
8MB
95W
DDR3-1866 MHz
C32
4332 HE
6
3.0GHz
3.7GHz
8MB
65W
DDR3-1866 MHz
C32
4310 EE
4
2.2GHz
3.0GHz
8MB
35W
DDR3-1866 MHz
C32




AMD Opteron™ 4300 Series Processors
Model Number
Cores
Core Speed
AMD Turbo CORE Max Frequency
L3 Cache
TDP
Socket Type

4386
8
3.1GHz
3.8GHz
8MB
95W 
C32

4376 HE
8
2.6GHz
3.6GHz
8MB
65W 
C32

4340
6
3.5GHz
3.8GHz
8MB
95W
C32

4334
6
3.1GHz
3.5GHz
8MB
95W
C32

4332 HE
6
3.0GHz
3.7GHz
8MB
65W
C32

4310 EE
4
2.2GHz
3.0GHz
8MB
35W
C32





Processor
AMD Opteron™ 4300 Series Processor
Model
4386
AMD Virtualization Technology
Yes
AMD-P (Power Management)
Yes
OPN Tray
OS4386WLU8KHK
OPN PIB
n/a
Revision
C0
Core Count
8
Base Speed (MHz)
3100
System Bus Speed (MT/s)
6400
Voltages
Max Temps (C)
70.5'C
Wattage
95 W
L1 Cache Size (KB)
48
L1 Cache Count
8
L2 Cache Size (KB)
1000
L2 Cache Count
8
L2 Cache Speed (MHz)
3100
L3 Cache Size (KB)
8192
CMOS
32nm
Integrated Memory Controller Speed (MHz)
2200
Floating Point Unit
Socket
C32




Data taken from http://www.amd.com/us/products/server/processors/4000-series-platform/4300/Pages/4300-series-processors.aspx (accessed on Jan 13, 2013)

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